epoxy die attachment

epoxy die attachment
lusto priklijavimas epoksidu statusas T sritis radioelektronika atitikmenys: angl. epoxy die attachment vok. Chipbonden mit Epoxidkleber, n rus. прикрепление кристалла ИС эпоксидным клеем, n pranc. connexion de puce par adhésif époxy, f

Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. . 2000.

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  • Die attachment — is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure. For high powered applications, the die is usually eutectic bonded onto the… …   Wikipedia

  • connexion de puce par adhésif époxy — lusto priklijavimas epoksidu statusas T sritis radioelektronika atitikmenys: angl. epoxy die attachment vok. Chipbonden mit Epoxidkleber, n rus. прикрепление кристалла ИС эпоксидным клеем, n pranc. connexion de puce par adhésif époxy, f …   Radioelektronikos terminų žodynas

  • Chipbonden mit Epoxidkleber — lusto priklijavimas epoksidu statusas T sritis radioelektronika atitikmenys: angl. epoxy die attachment vok. Chipbonden mit Epoxidkleber, n rus. прикрепление кристалла ИС эпоксидным клеем, n pranc. connexion de puce par adhésif époxy, f …   Radioelektronikos terminų žodynas

  • lusto priklijavimas epoksidu — statusas T sritis radioelektronika atitikmenys: angl. epoxy die attachment vok. Chipbonden mit Epoxidkleber, n rus. прикрепление кристалла ИС эпоксидным клеем, n pranc. connexion de puce par adhésif époxy, f …   Radioelektronikos terminų žodynas

  • прикрепление кристалла ИС эпоксидным клеем — lusto priklijavimas epoksidu statusas T sritis radioelektronika atitikmenys: angl. epoxy die attachment vok. Chipbonden mit Epoxidkleber, n rus. прикрепление кристалла ИС эпоксидным клеем, n pranc. connexion de puce par adhésif époxy, f …   Radioelektronikos terminų žodynas

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